Quanterion Handbooks

217Plus-2015_borderHDBK-217Plus™:2015, Notice 1
217Plus™:2015, Notice 1 is the latest revision to the popular 217Plus™ Handbook of Reliability Prediction Models based on the original MIL-HDBK-217, Reliability Prediction of Electronic Equipment. Available exclusively through Quanterion, 217Plus™:2015, Notice 1 replaces the original software reliability prediction model with the Neufelder Model for software reliability prediction.

 
Copyright Neufelder Model © 2017 by SoftRel, LLC. Licensed to Quanterion Solutions and used by permission.

 

practical_applications_QuanterionPractical Applications of the RIAC System Reliability Toolkit
The purpose of this publication is to provide illustrative examples of the more common mathematical calculations and statistical techniques utilized by reliability engineers in the practical performance of their daily activities. It is intended to be used as a companion to the RIAC “System Reliability Toolkit”, as the foundations of all of the techniques illustrated in this publication are discussed therein.

 

Other Publications Available through Quanterion

Quanterion’s work in the reliability field has led to numerous rewarding relationships with professionals and organizations engaged in similar efforts. Some of these individuals have also developed products to address specific aspects of the reliability, maintainability and quality (RMQ) discipline, which, through cooperative agreements, are available for purchase through our website. Such publications include the following:

BundleThe SuperSmith® Package by Fulton Findings LLC
SuperSMITH®, developed by Fulton Findings LLC, is the leading software package for Weibull Engineering. The software comes on a single CD and installs on standard Windows® systems or Windows emulators in seconds. This software performs variability analysis for life data or for dimension data. Important uses are for reliability, safety, maintainability, supportability, quality control, product assurance, sizing, and warranty analysis.

BundlePhysics-of-Failure Based Handbook of Microelectronic Systems
This handbook is intended for use by designers of highly complex electronic systems for military, aerospace, medical, telecommunications or any industry where an accurate assessment of reliability is needed and can be verified through testing.

 
Copyright © January 2008 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

BundleA Practical Guide to Developing Reliable Human-Machine Systems 2nd Edition
This publication has four objectives: (1) Motivate designers to consider the impact of humans early in the development of systems and processes, when the opportunities for improvement are the greatest. (2) Serve as a bridge or intermediate step between introductory tutorials and short courses on human factors and human reliability and the many excellent but more extensive texts on human factors. (3) Serve as a highly understandable and readily accessible source of human factors and human reliability information to those who have limited acquaintances with these subjects. (4) Provide information on types of tools that are useful in human-oriented design.

 
Copyright ©K.P. LaSala Reprinted by permission of the author.

 

BundleEffective Application of Software Failure Modes Effects Analysis & Software FMEA Toolkit Bundle
This is a bundled package consisting of Effective Application of Software Failure Modes Effects Analysis & Software FMEA Toolkit.

 
Copyright ©SoftRel, LLC

 

EASFMEAEffective Application of Software Failure Modes Effects Analysis
This book is a practical step-by-step guide for reliability or software engineering practitioners. It illustrates each of the steps for performing a software FMEA and presents dozens of software failure modes and root causes. This book covers the eight possible viewpoints for conducting a SFMEA – requirements, interface design, detailed design and code, vulnerabilities, corrective actions, serviceability, usability and development processes.

 
Copyright ©SoftRel, LLC

 

ARE_Cover-Vol-I_fifth-edition_QApplied Reliability Engineering Volume I, 5th Ed.
This book provides an introduction to reliability engineering, with an emphasis on concepts and basic principles. It contains practical applications to guide the reader to appreciate the value of each topic presented, but is not intended to be used as a handbook or reference book. The first volume focuses upon metrics of reliability and methods of achieving reliable components.

 
Copyright © January 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

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ARE_Cover-Vol-II_fifth-edition_QApplied Reliability Engineering Volume II, 5th Ed.
This book provides an introduction to reliability engineering, with an emphasis on concepts and basic principles. It contains practical applications to guide the reader to appreciate the value of each topic presented, but is not intended to be used as a handbook or reference book. The second volume focuses upon system reliability, system analysis techniques and unique problems that arise from interactions between distinct parts of a system.

 
Copyright © January 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability of High Temperature Electronics
This book provides a working knowledge of high temperature devices/packaging, addressing the reliability and packaging concerns for designing at elevated temperatures.

 
Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability and Quality in Microelectronic Manufacturing
The manufacture of microcircuits begins with the silicon or gallium arsenide wafer and, after several processing operations, results in a fully packaged electronic component. For semiconductor manufacturing, the processing operations allow the industry to design-in reliability through the proper selection of materials, processing parameters, and technologies.

 
Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability of Compound Semiconductor Analogue Integrated Circuits
This book will allow the GaAs technologist, designer and graduate student to become familiar with the issues related to product reliability and to develop the reliability prediction tools which ensure that reliability and performance margins are designed into each product.

 
Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Photonics Materials, Devices and Reliability
This publication presents photonics in the context of reliability.

 
Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

GaAs MMIC Reliability – High Temperature Behavior
The purpose of this book is to (1) address the issues affecting the reliability and the manufacture of GaAs MMICs and (2) present the industrial status (through an industrial database) in addressing such issues as yield, throughput, design rules, chip architecture, reliability, design for yield and manufacturability, substrate qualification, choice of processing technology and current status of process related models and sensitivity analysis.

 
Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

TheNewWeibullHandbook-150The New Weibull Handbook, 5th Ed.
Reliability & Statistical Analysis for Predicting Life, Safety, Risk, Support Costs, Failures, and Forecasting Warranty Claims, Substantiation and Accelerated Testing, Using Weibull, Log Normal, Crow-AMSAA, Probit and Kaplan-Meier Models

 
Copyright © 2004 by Dr. Robert B. Abernethy.