Publications Available through Quanterion

Quanterion’s work in the reliability field has led to numerous valuable relationships with professionals and organizations engaged in similar efforts. Some of these individuals have also developed products to address specific aspects of the reliability, maintainability and quality (RMQ) discipline, which, through cooperative agreements, are available for purchase through our website. Such publications include the following:

EASFMEAEffective Application of Software Failure Modes Effects Analysis – 2nd Edition
This publication is a practical step-by-step guide for reliability or software engineering practitioners, illustrating each of the steps in performing a software FMEA and identifies dozens of software failure modes and root causes. It covers the eight possible perspectives for conducting a software FMEA – requirements, interface design, detailed design and code, vulnerabilities, corrective actions, serviceability, usability and development processes.

Copyright ©Mission Ready Software

 

BundleBundle of: Effective Application of Software Failure Modes Effects Analysis and Software FMEA Toolkit – 2nd Edition
Includes Effective Application of Software Failure Modes Effects Analysis and Software FMEA Toolkit. The publication is a practical step-by-step guide for reliability or software engineering practitioners, illustrating the steps in performing a software FMEA and identifies dozens of software failure modes and root causes. The toolkit provides a FMEA template that accommodates the several hundred software related failure modes and root causes as well as the six software-specific viewpoints.

Copyright ©Mission Ready Software

 

The SuperSmith® Package by Fulton Findings LLCSuperSmith-Package-Reliability-Engineering
SuperSMITH®, developed by Fulton Findings LLC, is the leading software package for Weibull analysis. The software is provided on a single CD and installs on standard Windows® systems or Windows emulators in seconds. This software provides variability analysis for life data or for dimension data. Important uses are for reliability, safety, maintainability, supportability, quality control, product assurance, sizing, and warranty analysis.

 

 

TheNewWeibullHandbook-150The New Weibull Handbook, 5th Ed.
This publication describes reliability and statistical analysis for predicting life, safety, risk, support costs, failures, and forecasting warranty claims, substantiation and sccelerated testing, using Weibull, Log Normal, Crow-AMSAA, Probit and Kaplan-Meier Models.

Copyright © 2004 by Dr. Robert B. Abernethy.

 

BundlePhysics-of-Failure Based Handbook of Microelectronic Systems
This handbook is used by designers of highly complex electronic systems for military, aerospace, medical, telecommunications or any industry where an accurate assessment of reliability is needed and can be verified through testing.

Copyright © January 2008 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

BundleA Practical Guide to Developing Reliable Human-Machine Systems 2nd Edition
This publication has four objectives: (1) Motivate designers to consider the impact of humans early in the development of systems and processes, when the opportunities for improvement are the greatest. (2) Serve as a bridge or intermediate step between introductory tutorials and short courses on human factors and human reliability and the many excellent but more extensive texts on human factors. (3) Serve as a highly understandable and readily accessible source of human factors and human reliability information to those who have limited acquaintances with these subjects. (4) Provide information on types of tools that are useful in human-oriented design.

Copyright ©K.P. LaSala Reprinted by permission of the author.

 

ARE_Cover-Vol-I_fifth-edition_QApplied Reliability Engineering Volume I, 5th Ed.
This publication provides an introduction to reliability engineering, with an emphasis on concepts and basic principles. It contains practical applications to guide the reader to appreciate the value of each topic presented, but is not intended to be used as a handbook or reference book. The first volume focuses upon metrics of reliability and methods of achieving reliable components.

Copyright © January 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

 

ARE_Cover-Vol-II_fifth-edition_QApplied Reliability Engineering Volume II, 5th Ed.
This publication provides an introduction to reliability engineering, with an emphasis on concepts and basic principles. It contains practical applications to guide the reader to appreciate the value of each topic presented, but is not intended to be used as a handbook or reference book. The second volume focuses upon system reliability, system analysis techniques and unique problems that arise from interactions between distinct parts of a system.

Copyright © January 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability of High Temperature Electronics
This publication provides a working knowledge of high temperature devices/packaging, addressing the reliability and packaging concerns for designing at elevated temperatures.

Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability and Quality in Microelectronic Manufacturing
The manufacture of microcircuits begins with the silicon or gallium arsenide wafer and, after several processing operations, results in a fully packaged electronic component. For semiconductor manufacturing, the processing operations allow the industry to design-in reliability through the proper selection of materials, processing parameters, and technologies.

Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Reliability of Compound Semiconductor Analogue Integrated Circuits
This publication will allow the GaAs technologist, designer and graduate student to become familiar with the issues related to product reliability and to develop the reliability prediction tools which ensure that reliability and performance margins are designed into each product.

Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

Photonics Materials, Devices and Reliability
This publication presents photonics in the context of reliability. Design concepts are presented to promote material combinations that are robust and reliable. All wearout mechanisms must be understood, as well as their effect on performance. Metalizations and their degradation mechanisms must also be understood. This book highlights their contribution to overall photonic material and device reliability.

Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.

 

GaAs MMIC Reliability – High Temperature Behavior
The purpose of this publication is to (1) address the issues affecting the reliability and the manufacture of GaAs MMICs and (2) present the industrial status (through an industrial database) in addressing such issues as yield, throughput, design rules, chip architecture, reliability, design for yield and manufacturability, substrate qualification, choice of processing technology and current status of process related models and sensitivity analysis.

Copyright © 2006 by The Center for Reliability Engineering, University of Maryland, College Park, Maryland, USA.